Package
Micro Package Solution - SNT Package (Small Outline Non-leaded Thin Package)
Employment of a newly developed ultra-small SNT package realizes a much smaller mounting space compared with conventional products, enabling high-density mounting. The SNT-6A(H) package also realizes a power dissipation of 500 mW.
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| SNT-4A | SNT-6A, SNT-6A(H) | SNT-8A |
| 1.2×1.6×0.5t mm | 1.57×1.8×0.5t mm | 1.97×2.46×0.5t mm |
Features of SNT
| Package code | SNT-4A | SNT-6A | SNT-6A(H) | SNT-8A |
|---|---|---|---|---|
| Number of pins | 4 | 6 | 6 | 8 |
| Sealing resin | Epoxy | Epoxy | Epoxy | Epoxy |
| Dimensions / mm | 1.2 × 1.6 × 0.5t max. | 1.57 × 1.8 × 0.5t max. | 1.57 × 1.8 × 0.5t max. | 1.97 × 2.46 × 0.5t max. |
| Pin pitch / mm | 0.65 | 0.5 | 0.5 | 0.5 |
| Pin surface processing | Sn 100% | Sn 100% | Sn 100% | Sn 100% |
| Mass (mg) | 2.4 | 3.6 | 3.5 | 6.9 |
| Power dissipation (mW) (when mounted on board)* |
300 | 400 | 500 | 450 |
| MSL | JEDEC Level 1 | JEDEC Level 1 | JEDEC Level 1 | JEDEC Level 1 |
| Flame retardant | UL94-V-0 | UL94-V-0 | UL94-V-0 | UL94-V-0 |
Note: Power dissipation data on board are to be obtained.